Datapaq® Reflow Tracker Thermal Profiling System

The Profiling Solution for the Electronics Assembly Industry

Measure and track process stability

  • Collect repeatable data and create SPC analysis to predict maintenance needs in advance
  • Ensure and prove that solder profile specifications are met
  • Fine-tune the soldering process to maximize throughput
  • Automate the selection of oven settings for faster changeover times

Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations.

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